An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

Shreesha Prabhu; Sankaran Koyili; M. S. Manjunath; M. M. Nayak

doi:10.1109/ICEmElec.2014.7151206

An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

Shreesha Prabhu, Sankaran Koyili, M. S. Manjunath, M. M. Nayak

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.

Original language	English
Title of host publication	2014 IEEE 2nd International Conference on Emerging Electronics
Subtitle of host publication	Materials to Devices, ICEE 2014 - Conference Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781467365277
DOIs	https://doi.org/10.1109/ICEmElec.2014.7151206
Publication status	Published - 01-01-2014
Externally published	Yes
Event	2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014 - Bengaluru, India Duration: 03-12-2014 → 06-12-2014

Conference

Conference	2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014
Country/Territory	India
City	Bengaluru
Period	03-12-14 → 06-12-14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ICEmElec.2014.7151206

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Prabhu, S., Koyili, S., Manjunath, M. S., & Nayak, M. M. (2014). An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices. In 2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings [7151206] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEmElec.2014.7151206

@inproceedings{2f062de147ce4fa49abb4b020f22e9bd,

title = "An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices",

abstract = "Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.",

author = "Shreesha Prabhu and Sankaran Koyili and Manjunath, {M. S.} and Nayak, {M. M.}",

year = "2014",

month = jan,

day = "1",

doi = "10.1109/ICEmElec.2014.7151206",

language = "English",

booktitle = "2014 IEEE 2nd International Conference on Emerging Electronics",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014 ; Conference date: 03-12-2014 Through 06-12-2014",

}

Prabhu, S, Koyili, S, Manjunath, MS & Nayak, MM 2014, An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices. in 2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings., 7151206, Institute of Electrical and Electronics Engineers Inc., 2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014, Bengaluru, India, 03-12-14. https://doi.org/10.1109/ICEmElec.2014.7151206

An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices. / Prabhu, Shreesha; Koyili, Sankaran; Manjunath, M. S. et al.

2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 7151206.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

AU - Prabhu, Shreesha

AU - Koyili, Sankaran

AU - Manjunath, M. S.

AU - Nayak, M. M.

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.

AB - Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.

UR - http://www.scopus.com/inward/record.url?scp=84988259152&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84988259152&partnerID=8YFLogxK

U2 - 10.1109/ICEmElec.2014.7151206

DO - 10.1109/ICEmElec.2014.7151206

M3 - Conference contribution

AN - SCOPUS:84988259152

BT - 2014 IEEE 2nd International Conference on Emerging Electronics

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014

Y2 - 3 December 2014 through 6 December 2014

ER -

Prabhu S, Koyili S, Manjunath MS, Nayak MM. An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices. In 2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 7151206 doi: 10.1109/ICEmElec.2014.7151206

An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

Abstract

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All Science Journal Classification (ASJC) codes

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