An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

Shreesha Prabhu, Sankaran Koyili, M. S. Manjunath, M. M. Nayak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.

Original languageEnglish
Title of host publication2014 IEEE 2nd International Conference on Emerging Electronics
Subtitle of host publicationMaterials to Devices, ICEE 2014 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467365277
DOIs
Publication statusPublished - 01-01-2014
Externally publishedYes
Event2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014 - Bengaluru, India
Duration: 03-12-201406-12-2014

Conference

Conference2014 2nd IEEE International Conference on Emerging Electronics, ICEE 2014
CountryIndia
CityBengaluru
Period03-12-1406-12-14

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Prabhu, S., Koyili, S., Manjunath, M. S., & Nayak, M. M. (2014). An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices. In 2014 IEEE 2nd International Conference on Emerging Electronics: Materials to Devices, ICEE 2014 - Conference Proceedings [7151206] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEmElec.2014.7151206