Computational fluid dynamics study of the aortic valve opening on hemodynamics characteristics

Adi A. Basri, Mohamed Zubair, Ahmad F A Aziz, Rosli M. Ali, Masaaki Tamagawa, Kamarul A. Ahmad

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this work, the 3D geometry of patient specific aorta was utilized to carry out CFD studies on the effect of different valve opening (45°,62.5° and fully opening) on the hemodynamic properties. The result shows that the lower valve opening induced jet flow and hampered the flow on the additional carotid arteries. Besides, the leaflets were subjected to extreme stress values having disastrous consequences. Consequently, stenosis which is characterized by weaker leaflets and low valve openings has serious impact on the well being of humans.

Original languageEnglish
Title of host publicationIECBES 2014, Conference Proceedings - 2014 IEEE Conference on Biomedical Engineering and Sciences
Subtitle of host publication"Miri, Where Engineering in Medicine and Biology and Humanity Meet"
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages99-102
Number of pages4
ISBN (Electronic)9781479940844
DOIs
Publication statusPublished - 23-02-2015
Event3rd IEEE Conference on Biomedical Engineering and Sciences, IECBES 2014 - Kuala Lumpur, Malaysia
Duration: 08-12-201410-12-2014

Conference

Conference3rd IEEE Conference on Biomedical Engineering and Sciences, IECBES 2014
CountryMalaysia
CityKuala Lumpur
Period08-12-1410-12-14

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All Science Journal Classification (ASJC) codes

  • Biomedical Engineering

Cite this

Basri, A. A., Zubair, M., Aziz, A. F. A., Ali, R. M., Tamagawa, M., & Ahmad, K. A. (2015). Computational fluid dynamics study of the aortic valve opening on hemodynamics characteristics. In IECBES 2014, Conference Proceedings - 2014 IEEE Conference on Biomedical Engineering and Sciences: "Miri, Where Engineering in Medicine and Biology and Humanity Meet" (pp. 99-102). [7047660] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IECBES.2014.7047660