Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

B. Shivamurthy, B. H.S. Thimmappa, Rohan Purushothama, G. K.V.D. Datta Sai

Research output: Contribution to journalArticle

Abstract

Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.

Original languageEnglish
Pages (from-to)99-106
Number of pages8
JournalTransactions on Electrical and Electronic Materials
Volume20
Issue number2
DOIs
Publication statusPublished - 05-04-2019

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Polymer films
Copper
Cellulose
Polymers
Mechanical properties
Signal interference
Shielding
Fillers
Composite materials
Composite films
Metal foil
Strength of materials
Foams
Electric Conductivity
acetylcellulose
Elongation
Durability
Tensile strength

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

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abstract = "Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt{\%}) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt{\%} and the drastic increase in conductivity at 28–37 wt{\%}. The mechanical strength of CA/Cu composite films was investigated and reported.",
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Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films. / Shivamurthy, B.; Thimmappa, B. H.S.; Purushothama, Rohan; Datta Sai, G. K.V.D.

In: Transactions on Electrical and Electronic Materials, Vol. 20, No. 2, 05.04.2019, p. 99-106.

Research output: Contribution to journalArticle

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