Electrical measurement of undercut in surface micromachining

Somashekara Bhat, Enakshi Bhattacharya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In a surface micromachined cantilever the beam thickness, width and the gap get modified during fabrication. Since performance of sensors and actuators strongly depend on the final geometry, it is essential to measure these parameters. Electrical measurements have several advantages over microscopy and we present here two different electrical techniques to measure undercut due to etching. In the resistance based approach, two polysilicon resistors of different length and width are used and the undercut is extracted from the ratio of the measured resistances. In the second technique, resonance frequency is measured for two sets of oxide anchored polysilicon cantilever beams with 20 and 30 um widths. For a given length, the ratio between the measured frequencies for the two widths gives the value of undercut. Measurements are done on both wet and dry etched polysilicon.

Original languageEnglish
Title of host publicationReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
Volume6884
DOIs
Publication statusPublished - 2008
EventReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - San Jose, CA, United States
Duration: 21-01-200822-01-2008

Conference

ConferenceReliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
CountryUnited States
CitySan Jose, CA
Period21-01-0822-01-08

Fingerprint

Surface micromachining
Micromachining
micromachining
Polysilicon
electrical measurement
Cantilever beams
Resistors
Oxides
Cantilever Beam
Resonance Frequency
cantilever beams
Etching
Cantilever
Microscopic examination
Actuators
Microscopy
resistors
Fabrication
Actuator
Geometry

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Bhat, S., & Bhattacharya, E. (2008). Electrical measurement of undercut in surface micromachining. In Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII (Vol. 6884). [68840R] https://doi.org/10.1117/12.764417
Bhat, Somashekara ; Bhattacharya, Enakshi. / Electrical measurement of undercut in surface micromachining. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII. Vol. 6884 2008.
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Bhat, S & Bhattacharya, E 2008, Electrical measurement of undercut in surface micromachining. in Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII. vol. 6884, 68840R, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, San Jose, CA, United States, 21-01-08. https://doi.org/10.1117/12.764417

Electrical measurement of undercut in surface micromachining. / Bhat, Somashekara; Bhattacharya, Enakshi.

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII. Vol. 6884 2008. 68840R.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Bhat S, Bhattacharya E. Electrical measurement of undercut in surface micromachining. In Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII. Vol. 6884. 2008. 68840R https://doi.org/10.1117/12.764417