Extraction of residual stress and dimensions from electrical measurements on surface micromachined test structures

Somashekara Bhat, Enakshi Bhattacharya

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The deposited thin films in surface micromachining have a lot of residual stress, and it is essential to measure this for both process development and monitoring. We estimate residual stress by electrical measurements on a series of fixed-fixed polysilicon beams designed to deflect laterally due to stress. To minimize errors in estimation during parameter extraction, the device dimensions also have to be measured accurately. Surface micromachining of an oxide-anchored polysilicon cantilever beam can result in beam undercut, reduction in beam thickness, and increase in the gap between the beam and the substrate. The undercut in the beam is estimated from the resonance frequency of the cantilever beam and also by using polysilicon resistors. Final device thickness is obtained by measuring the resistance in fixed-fixed beams.

Original languageEnglish
Article number031309
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Volume8
Issue number3
DOIs
Publication statusPublished - 2009

Fingerprint

Polysilicon
electrical measurement
residual stress
Surface micromachining
Residual stresses
Cantilever beams
Parameter extraction
cantilever beams
micromachining
Resistors
Oxides
Thin films
Monitoring
Substrates
resistors
oxides
estimates
thin films

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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title = "Extraction of residual stress and dimensions from electrical measurements on surface micromachined test structures",
abstract = "The deposited thin films in surface micromachining have a lot of residual stress, and it is essential to measure this for both process development and monitoring. We estimate residual stress by electrical measurements on a series of fixed-fixed polysilicon beams designed to deflect laterally due to stress. To minimize errors in estimation during parameter extraction, the device dimensions also have to be measured accurately. Surface micromachining of an oxide-anchored polysilicon cantilever beam can result in beam undercut, reduction in beam thickness, and increase in the gap between the beam and the substrate. The undercut in the beam is estimated from the resonance frequency of the cantilever beam and also by using polysilicon resistors. Final device thickness is obtained by measuring the resistance in fixed-fixed beams.",
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Extraction of residual stress and dimensions from electrical measurements on surface micromachined test structures. / Bhat, Somashekara; Bhattacharya, Enakshi.

In: Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 3, 031309, 2009.

Research output: Contribution to journalArticle

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