Highly thermal conductive epoxy nanocomposites filled with 3D BN/C spatial network prepared by salt template assisted method

Duo Pan, Qianming Li, Wei Zhang, Jingwen Dong, Fengmei Su, Vignesh Murugadoss, Yongzhi Liu, Chuntai Liu, Nithesh Naik, Zhanhu Guo

Research output: Contribution to journalArticlepeer-review

Abstract

The construction of heat conduction paths in the polymer matrix is essential to improve the thermal management performance of polymer composites. A three-dimensional (3D) thermally conductive network with regular filler structures is very attractive for building fast conductive paths in polymer composites. Herein, a unique 3D interconnected tannic acid modified boron nitride (BN) and C network (M-BN/C) was successfully fabricated by the carbonization of M-BN/thermoplastic polyurethane (TPU) skeletons, which were obtained via simple salt template assisted strategy to enhance the thermal transfer properties of composites. The highly thermally conductive epoxy composites (M-BN/C/EP) were then prepared by impregnating epoxy resin (EP) into the 3D M-BN/C network. The thermal conductivity of the composites with a M − BN loading of 23 wt% is as high as 1.524 W/(m·K), which exhibits a significant enhancement of 702% compared with pure EP. In addition, our composite exhibited outstanding thermal behaviors during heating and cooling processes. Furthermore, the finite element heat conduction simulation further analyzes the heat conduction mechanism of epoxy composites from the theoretical level. This work provides a new idea to significantly enhance the thermal conductivity of thermal management materials.

Original languageEnglish
Article number108609
JournalComposites Part B: Engineering
Volume209
DOIs
Publication statusPublished - 15-03-2021

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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