Parameter extraction from simple electrical measurements on surface micromachined cantilevers

Somashekara Bhat, Enakshi Bhattacharya

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

In surface micromachined structures, many parameters like geometry and Young's modulus depend on the process steps and need to be measured for accurate prediction of their functionality. This work discusses simple electrical measurement techniques on surface micromachined cantilever beams to determine Young's modulus, the gap between the beam and the substrate, and the thickness of a deposited aluminum layer on the beam. Cantilevers are ubiquitous in most microelectromechanical system (MEMS) sensors and actuators, and hence are ideal test structures. Pull-in, and a novel resonance frequency measurement based on the pull-in technique, are done on oxide anchored doped polysilicon beams at the wafer level, and some of the device and material properties are extracted from these measurements. The extracted values are compared with those determined from established methods like vibrometry and surface profiler measurements, and show good agreement. Since the measurements are all electrical, they can be part of standardized testing and are also suitable for packaged devices.

Original languageEnglish
Article number043013
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Volume6
Issue number4
DOIs
Publication statusPublished - 2007

Fingerprint

Parameter extraction
electrical measurement
modulus of elasticity
cantilever beams
Elastic moduli
frequency measurement
microelectromechanical systems
Surface measurement
Cantilever beams
actuators
Aluminum
Polysilicon
wafers
Oxides
MEMS
aluminum
Materials properties
Actuators
oxides
sensors

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

@article{de7bdb321a084076820ea672e6019021,
title = "Parameter extraction from simple electrical measurements on surface micromachined cantilevers",
abstract = "In surface micromachined structures, many parameters like geometry and Young's modulus depend on the process steps and need to be measured for accurate prediction of their functionality. This work discusses simple electrical measurement techniques on surface micromachined cantilever beams to determine Young's modulus, the gap between the beam and the substrate, and the thickness of a deposited aluminum layer on the beam. Cantilevers are ubiquitous in most microelectromechanical system (MEMS) sensors and actuators, and hence are ideal test structures. Pull-in, and a novel resonance frequency measurement based on the pull-in technique, are done on oxide anchored doped polysilicon beams at the wafer level, and some of the device and material properties are extracted from these measurements. The extracted values are compared with those determined from established methods like vibrometry and surface profiler measurements, and show good agreement. Since the measurements are all electrical, they can be part of standardized testing and are also suitable for packaged devices.",
author = "Somashekara Bhat and Enakshi Bhattacharya",
year = "2007",
doi = "10.1117/1.2794291",
language = "English",
volume = "6",
journal = "Journal of Micro/ Nanolithography, MEMS, and MOEMS",
issn = "1932-5150",
publisher = "SPIE",
number = "4",

}

Parameter extraction from simple electrical measurements on surface micromachined cantilevers. / Bhat, Somashekara; Bhattacharya, Enakshi.

In: Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 6, No. 4, 043013, 2007.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Parameter extraction from simple electrical measurements on surface micromachined cantilevers

AU - Bhat, Somashekara

AU - Bhattacharya, Enakshi

PY - 2007

Y1 - 2007

N2 - In surface micromachined structures, many parameters like geometry and Young's modulus depend on the process steps and need to be measured for accurate prediction of their functionality. This work discusses simple electrical measurement techniques on surface micromachined cantilever beams to determine Young's modulus, the gap between the beam and the substrate, and the thickness of a deposited aluminum layer on the beam. Cantilevers are ubiquitous in most microelectromechanical system (MEMS) sensors and actuators, and hence are ideal test structures. Pull-in, and a novel resonance frequency measurement based on the pull-in technique, are done on oxide anchored doped polysilicon beams at the wafer level, and some of the device and material properties are extracted from these measurements. The extracted values are compared with those determined from established methods like vibrometry and surface profiler measurements, and show good agreement. Since the measurements are all electrical, they can be part of standardized testing and are also suitable for packaged devices.

AB - In surface micromachined structures, many parameters like geometry and Young's modulus depend on the process steps and need to be measured for accurate prediction of their functionality. This work discusses simple electrical measurement techniques on surface micromachined cantilever beams to determine Young's modulus, the gap between the beam and the substrate, and the thickness of a deposited aluminum layer on the beam. Cantilevers are ubiquitous in most microelectromechanical system (MEMS) sensors and actuators, and hence are ideal test structures. Pull-in, and a novel resonance frequency measurement based on the pull-in technique, are done on oxide anchored doped polysilicon beams at the wafer level, and some of the device and material properties are extracted from these measurements. The extracted values are compared with those determined from established methods like vibrometry and surface profiler measurements, and show good agreement. Since the measurements are all electrical, they can be part of standardized testing and are also suitable for packaged devices.

UR - http://www.scopus.com/inward/record.url?scp=37549002897&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=37549002897&partnerID=8YFLogxK

U2 - 10.1117/1.2794291

DO - 10.1117/1.2794291

M3 - Article

VL - 6

JO - Journal of Micro/ Nanolithography, MEMS, and MOEMS

JF - Journal of Micro/ Nanolithography, MEMS, and MOEMS

SN - 1932-5150

IS - 4

M1 - 043013

ER -