Soldering of copper using graphene-phosphoric acid gel

Gurudatt Puranik, Asis Sarkar, Nirankar Mishra, Sangam Chandrasekhar Gurumurthy, Shridhar Mundinamani

Research output: Contribution to journalArticlepeer-review

Abstract

Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260°C. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.

Original languageEnglish
Pages (from-to)60-67
Number of pages8
JournalJournal of Metals, Materials and Minerals
Volume30
Issue number4
DOIs
Publication statusPublished - 2020

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials

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