Study on effect of thermo-structural loading on the PCB during Selective Soldering process using finite element method

Subraya Krishna Bhat, Raghavendra Deshpande, Peter Beck, Sudarshan Hegde, Y. S. Upadhyaya, Chandan Kumar Ghosh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds